Dielectric Barrier Discharge Atmospheric Air Plasma Treatment of High Amylose Corn Starch Films

Shashi Pankaj, Dublin Institute of Technology
C. Bueno-Ferrer, Dublin Institute of Technology
N. Misra, Dublin Institute of Technology
Luke O'Neill, Dublin Institute of Technology
B.K. Tiwari, Teagasc Food Research Center
Paula Bourke, Dublin Institute of Technology
Patrick Cullen, Dublin Institute of Technology

Document Type Article

LWT-Food Science and Technology



Atmospheric dielectric barrier discharge plasma is a novel non-thermal technology for food decontamination. The effects of dielectric barrier discharge plasma on the surface topography, thermal behavior, chemical composition and water vapor permeability of high amylose corn starch films have been examined. Plasma treatment significantly increased the surface roughness of the starch films. Thermal degradation profiles of all the starch films were similar, although a decrease in the maximum degradation temperature was observed after plasma treatment. X-ray photoelectron spectroscopy and Fourier transform Infrared spectra confirmed the increase in surface oxygen content and appearance of new O=C–O groups on the film surface after plasma treatment at 70 and 80 kV for 5 minutes. X-ray diffraction showed the A-type crystal structure which was not affected by plasma treatment. Surface hydrophilicity was also found higher after cold plasma treatment. Although, no significant change in the water vapor permeability was observed. The evaluation of plasma induced changes in the biodegradable polymers shows the compatibility of two environmentally-friendly strategies in food technology: cold plasma decontamination of food packaged with biodegradable materials.