Document Type

Article

Rights

Available under a Creative Commons Attribution Non-Commercial Share Alike 4.0 International Licence

Disciplines

Information Science

Publication Details

IEEE Transactions on Components and Packaging Technologies, vol. 33, no. 2, pp. 470-477, June 2010

Abstract

In this paper, we investigate the feasibility of using a laser as the heat source to drive a hermetic joining process based on a glass frit intermediate layer. The laser allows the necessary heat energy to be provided in a localized manner; important either as part of a multistage process, or to allow thermally-sensitive materials to be used inside the package. Our study includes an investigation of the impact of rough and grooved surfaces on the hermeticity and strength of the join, demonstrating the robust nature of the process, and its ability to allow feed-throughs to the center of package. Hermetic sealing is demonstrated, with leak rates of 10−9 mbar l s−1, satisfying the military standard MIL-STD-883G.

DOI

https://doi.org/10.1109/TCAPT.2010.2045000

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